The Nepcon Japan 2025 (39th Japan Electronics Technology Exhibition) will be held at the Ariake Exhibition Center in Tokyo, Japan from January 22 to 24. WCON is in Hall E, Booth E24-31!

The BH762 Series is a 7.62mm pitch wire to board terminal block connector that features a more compact overall design, effectively saving 30% in installation space.

The 13th GBA International New Energy Auto Technology and Supply Chain Expo(NEAS CHINA 2024) will be held on 4-6 December at the Shenzhen International Convention and Exhibition Centre.

The 3750X Series is a 0.8mm dual-row high-speed board-to-board connector that is high-density, high-performance, and ruggedized for high-speed data transfer up to 56Gbps.

Electronica South China 2024 will be held on 14-16 October at Shenzhen International Convention and Exhibition Centre . With passion and expectation, WCON will bring the cutting-edge connector technology solutions to meet you in here.

The WD3810 and WD3811 series are wire to board and wire to wire connectors. Featuring a compact 3.81mm pitch and vertical/horizontal cable exit orientations, they adapt to high-density PCB layouts, enabling device miniaturization.

Electroncia 2024 will be held from November 12 to 15, 2024 at the Munich Trade Fair Center in Germany. We cordially invite you to visit our booth: A2.460.

The 5242 series is a IDC connector with pitch of 1.27mm (0.050 inches) and a row spacing of 2.54mm (0.100 inches). It offers flexible configurations ranging from 10 to 100 pins. The terminals feature an Insulation Displacement Connection (IDC) and single-point contact design. Its advantages include eliminating the need for wire stripping in crimping processes, simplifying assembly procedures, reducing assembly costs, and maintaining termination performance. It is an efficient wire-to-board connection solution.